JPH085550Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH085550Y2
JPH085550Y2 JP1989124255U JP12425589U JPH085550Y2 JP H085550 Y2 JPH085550 Y2 JP H085550Y2 JP 1989124255 U JP1989124255 U JP 1989124255U JP 12425589 U JP12425589 U JP 12425589U JP H085550 Y2 JPH085550 Y2 JP H085550Y2
Authority
JP
Japan
Prior art keywords
conductive adhesive
bump electrode
adhesive layer
bonding pad
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989124255U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0363929U (en]
Inventor
勇次 松田
久雄 川口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989124255U priority Critical patent/JPH085550Y2/ja
Publication of JPH0363929U publication Critical patent/JPH0363929U/ja
Application granted granted Critical
Publication of JPH085550Y2 publication Critical patent/JPH085550Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H01L2224/1182—Applying permanent coating, e.g. in-situ coating
    • H01L2224/11822—Applying permanent coating, e.g. in-situ coating by dipping, e.g. in a solder bath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/1354—Coating
    • H01L2224/1356—Disposition
    • H01L2224/13563—Only on parts of the surface of the core, i.e. partial coating
    • H01L2224/13565—Only outside the bonding interface of the bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1989124255U 1989-10-23 1989-10-23 半導体装置 Expired - Lifetime JPH085550Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989124255U JPH085550Y2 (ja) 1989-10-23 1989-10-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989124255U JPH085550Y2 (ja) 1989-10-23 1989-10-23 半導体装置

Publications (2)

Publication Number Publication Date
JPH0363929U JPH0363929U (en]) 1991-06-21
JPH085550Y2 true JPH085550Y2 (ja) 1996-02-14

Family

ID=31672187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989124255U Expired - Lifetime JPH085550Y2 (ja) 1989-10-23 1989-10-23 半導体装置

Country Status (1)

Country Link
JP (1) JPH085550Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4960444B2 (ja) * 2007-04-28 2012-06-27 太 木村 ゴルフパター練習装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63276237A (ja) * 1987-05-08 1988-11-14 Citizen Watch Co Ltd 基板へのｉｃボンディング方法
JPH0793306B2 (ja) * 1987-08-05 1995-10-09 日本電装株式会社 半導体集積回路装置
JPH06103701B2 (ja) * 1988-03-11 1994-12-14 松下電器産業株式会社 半導体装置の実装体

Also Published As

Publication number Publication date
JPH0363929U (en]) 1991-06-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term